SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device that secures a high frequency characteristic while securing high heat radiation performance.SOLUTION: A principal surface 50 as an element mount face of a heat spreader 22 is configured to be sloped, so that a high frequency characteristic can...

Full description

Saved in:
Bibliographic Details
Main Author YAMASHITA MASAYA
Format Patent
LanguageEnglish
Japanese
Published 21.12.2015
Subjects
APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS
BASIC ELECTRIC ELEMENTS
CONTROL OR REGULATION THEREOF
CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a semiconductor device that secures a high frequency characteristic while securing high heat radiation performance.SOLUTION: A principal surface 50 as an element mount face of a heat spreader 22 is configured to be sloped, so that a high frequency characteristic can be secured while securing high heat radiation performance. 【課題】高放熱性を確保しながら、高周波数特性を確保することを目的とする。【解決手段】ヒートスプレッダ２２の素子搭載面である主面５０を斜面にすることにより、高放熱性を確保しながら、高周波数特性を確保することができる。【選択図】図１
Bibliography:Application Number: JP20140118244