METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

• Main Author: TAKAMI KOKI
• Format: Patent
• Language: English; Japanese
• Published: 21.12.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PICTORIAL COMMUNICATION, e.g. TELEVISION; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which can solve a problem that dispersion in flatness occurs within a wafer surface.SOLUTION: A method of manufacturing a semiconductor device prepares a wafer on which an insulator having plural portions serving as se...