ELECTRONIC DEVICE

• Main Author: ITO HIROHIDE
• Format: Patent
• Language: English; Japanese
• Published: 21.12.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide an electronic device which is excellent in sealing performance even under a changing environment.SOLUTION: In the electronic device having a body unit on a substrate 1 sealed by a sealing material 3, the substrate 1 and the sealing material 3 are bonded in a manner to sandwich an extraction electrode 4 formed to expose from the body unit. The thickness of a junction 5 between the substrate 1 and the sealing material 3 is within the range of 0.1 to 100.0 nm. The sealing material 3 includes a gas barrier layer 32 and a support medium 31 for the gas barrier layer 32. The Young's modulus of the support medium 31 at a temperature of 25°C is within the range of 0.1-3.5 GPa. 【課題】本発明の課題は、変化する環境下においても封止性能に優れた電子デバイスを提供することである。【解決手段】基板１上の本体ユニットが封止材３によって封止された電子デバイスであって、前記基板１と前記封止材３とが、前記本体ユニットから露出するように形成された引き出し電極４を挟んで接合され、前記基板１と前記封止材３の接合部５の厚さが、０．１〜１００．０ｎｍの範囲内にあり、前記封止材３が、ガスバリアー層３２と、当該ガスバリアー層３２の支持体３１とを備え、前記支持体３１の温度２５℃におけるヤング率が、０．１〜３．５ＧＰａの範囲内にあることを特徴とする電子デバイス。【選択図】図２