RESIN COMPOSITION FOR ENCAPSULATING OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR DEVICE

• Main Author: HIDAKA AKIRA
• Format: Patent
• Language: English; Japanese
• Published: 17.12.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a resin composition for encapsulating an optical semiconductor high in initial and post heat treatment transmission factor and providing a cured article excellent in adhesiveness with an outer resin, and an optical semiconductor encapsulated with the resin composition.SOLUTION: There are provided a resin composition for encapsulating an optical semiconductor containing (A) an epoxy resin, (B) triglycidyl isocyanate, (C) a curing agent and (D) an inorganic filler as essential components with the (D) inorganic filler of 75 to 95 mass% of the total amount of the resin component where silica of 80 to 98 mass% and magnesium hydroxide of 2 to 20 mass% are contained in the total amount of the inorganic filler, and an optical semiconductor device encapsulated by the resin composition. 【課題】初期及び熱処理後の透過率が高く、アウター樹脂との密着性に優れる硬化物を与える光半導体封止用樹脂組成物および同樹脂組成物で封止されてなる光半導体装置を提供すること。【解決手段】（Ａ）エポキシ樹脂、（Ｂ）トリグリジシルイソシアヌレート、（Ｃ）硬化剤および（Ｄ）無機充填剤を必須成分とする光半導体封止用樹脂組成物であって、前記（Ｄ）無機充填剤が樹脂組成物全量の７５〜９５質量％含まれるとともに、無機充填剤全量のうちシリカが８０〜９８質量％、水酸化マグネシウムが２〜２０質量％含まれること特徴とする光半導体封止用樹脂組成物および同樹脂組成物で封止されてなる光半導体装置である。【選択図】なし