SOLDER JOINT STRUCTURE

• Main Authors: KOYAMA RYUHEI, KUWATA TETSUYA, MAKIZOE HIROAKI
• Format: Patent
• Language: English; Japanese
• Published: 14.12.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; ELECTRICITY

PROBLEM TO BE SOLVED: To provide a solder joint structure which allows for highly reliable connection, without using a special solder for aluminum, even when an aluminum plate is used as an electrode plate.SOLUTION: In a solder joint structure for solder joining one end of a lead wire 2 to a metallicon electrode 1a of a capacitor element 1, and solder joining the other end of the lead wire 2 to an electrode plate 4, the electrode plate 4 is an aluminum plate 4b subjected to Ni plating or Sn plating to at least one of the front surface or back surface. While inserting the other end of the lead wire 2 into a through hole 4c provided in the electrode plate 4, solder joining is performed by straddling the solder 3 across the outer peripheral surface of the lead wire 2 and the front or back surface of the electrode plate 4, without bringing into contact with a hole wall surface 4d constituting the through hole 4c. 【課題】電極板としてアルミ板を用いた場合でも、アルミ用の特殊な半田を用いることなく、信頼性の高い接続が可能な半田接続構造を提供する。【解決手段】コンデンサ素子１のメタリコン電極１ａに引出し線２の一方端部を半田接続するとともに、電極板４に引出し線２の他方端部を半田接続する半田接続構造であって、電極板４は、その表面又は裏面の少なくとも一方にＮｉメッキ又はＳｎメッキが施されたアルミ板４ｂであり、電極板４に設けた貫通孔４ｃに引出し線２の他方端部を挿通させた状態において、半田３を、貫通孔４ｃを構成する孔壁面４ｄに接触させることなく、引出し線２の外周面と電極板４の表面又は裏面のメッキ面とに跨らせることで半田接続している。【選択図】図２