PHOTOSENSITIVE INSULATOR FILM FOR VIA HOLE FORMATION, AND VIA HOLE FORMATION METHOD USING THE SAME

• Main Authors: KIM CHON-YON, PARK CHAN JIN, KANG JUNG KYU, SEO YOUNG KWAN
• Format: Patent
• Language: English; Japanese
• Published: 03.12.2015
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a photosensitive insulator film for via hole formation, and a via hole formation method using the same.SOLUTION: According to one embodiment of the present invention, a photosensitive insulator film for via hole formation comprises a base substrate, a first insulator film formed on the base substrate, and a second insulator film formed on the first insulator film. The photosensitivity of the first insulator film is greater than the photosensitivity of the second insulator film. 【課題】本発明は、ビアホール形成用感光性絶縁フィルム及びそれを用いたビアホールの形成方法に関する。【解決手段】本発明の一実施形態によると、ベース基材と、上記ベース基材上に形成された第１絶縁フィルムと、上記第１絶縁フィルム上に形成された第２絶縁フィルムと、を含み、上記第１絶縁フィルムの光感度が上記第２絶縁フィルムの光感度より大きいビアホール形成用感光性絶縁フィルムが提供される。【選択図】図２