SPUTTERING APPARATUS
PROBLEM TO BE SOLVED: To provide a sputtering apparatus which allows easily changing a control method to improve a film thickness distribution.SOLUTION: A sputtering apparatus 100 according to the invention includes: three or more of cathode partition walls 9 arranged in a substrate transportation d...
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Main Author | |
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Format | Patent |
Language | English Japanese |
Published |
03.12.2015
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Subjects | |
Online Access | Get full text |
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