SPUTTERING APPARATUS

• Main Author: SASAKI MASAO
• Format: Patent
• Language: English; Japanese
• Published: 03.12.2015
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a sputtering apparatus which allows easily changing a control method to improve a film thickness distribution.SOLUTION: A sputtering apparatus 100 according to the invention includes: three or more of cathode partition walls 9 arranged in a substrate transportation direction to hold a target 4 for sequentially depositing a film to a substrate transported on a transportation roller 3; and a control selection unit 25 which selects and executes a control method which provides a most uniform film thickness distribution among multiple control methods for controlling a magnet driving unit 11 according to a transportation speed and the number of the target 4 used for deposition treatment. 【課題】膜厚分布を改善する制御方法を簡便に変更できるスパッタリング装置を提供する【解決手段】本発明のスパッタリング装置１００は、搬送ローラー３上を搬送される基板に対して順次成膜するためのターゲット４を保持するべく、基板の搬送方向に配列された３つ以上カソード隔壁９と、基板搬送速度及び成膜処理の際に使用されるターゲット４の数に応じて、マグネット駆動装置１１を制御する複数の制御方法の中から、最も均一な膜厚分布が得られるものを選択し実行する制御選択ユニット２５とを備えている。【選択図】図１４