ELECTRONIC COMPONENT UNIT

• Main Authors: KIYOSUE KAZUOMI, SHIRAIWA HIROKI
• Format: Patent
• Language: English; Japanese
• Published: 19.11.2015
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING; VEHICLES IN GENERAL; VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISEPROVIDED FOR

PROBLEM TO BE SOLVED: To provide an electronic component unit which can prevent erroneous assembling and can improve radiation performance.SOLUTION: An electronic component unit 1 is provided with a plate 2 mounted with an electronic component 22, and a housing 3. Either the plate 2 or the housing 3 has a first rib 28, and the other has a first rib receiving part 31l; moreover, either the plate 2 or the housing 3 has a second rib 29, while the other has a second rib receiving part 31m. Either the first rib 28 or the second rib receiving part 31m or either the second rib 29 or the first rib receiving part 31l are formed into a shape that disables engagement with each other; the first rib 28 and the first rib receiving part 31l are located nearer on the side of a connection part engaging part 33 than the electronic component 22 and are engaged; thereby, a first engaging heat transfer part 51 is configured. The second rib 29 and the second rib receiving part 31m are located nearer on the connection part engaging part 33 than the electronic component 22 and are engaged; thereby, a second engaging heat transfer part 52 is configured. 【課題】誤組み付けを防止しかつ放熱性能を向上することができる電子部品ユニットを提供することを目的とする。【解決手段】電子部品ユニット１は、電子部品２２が実装されたプレート２と、筐体３とを備え、プレート２、又は、筐体３の一方は、第１リブ２８を有し、他方は、第１リブ受け部３１ｌを有し、さらに、プレート２、又は、筐体３の一方は、第２リブ２９を有し、他方は、第２リブ受け部３１ｍを有する。第１リブ２８と第２リブ受け部３１ｍ、又は、第２リブ２９と第１リブ受け部３１ｌの一方は、相互に嵌合不能な形状に形成され、第１リブ２８と第１リブ受け部３１ｌとは、電子部品２２より接続部嵌合部３３側に位置し、嵌合することで第１嵌合伝熱部５１を構成し、第２リブ２９と第２リブ受け部３１ｍとは、電子部品２２より接続部嵌合部３３側に位置し嵌合することで第２嵌合伝熱部５２を構成する。【選択図】図１０