CONTROL DEVICE

PROBLEM TO BE SOLVED: To prevent overheat without excessively complicating a constitution of an entire control device and without excessively increasing area of a printed circuit board.SOLUTION: A control device includes a printed circuit board on which switch ICs as IC packages each including a sem...

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Bibliographic Details
Main Authors KUMAZAWA SHINJI, TODA SATOSHI
Format Patent
LanguageEnglish
Japanese
Published 19.11.2015
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Summary:PROBLEM TO BE SOLVED: To prevent overheat without excessively complicating a constitution of an entire control device and without excessively increasing area of a printed circuit board.SOLUTION: A control device includes a printed circuit board on which switch ICs as IC packages each including a semiconductor switch for high-side driving a resistive load and signal ground connection wiring are arranged. On the printed circuit board, a plurality of switch ICs are arranged. The control device includes an overheat protection component including a passive element which is connected to the high side of the plurality of switch ICs in common and has a function of interrupting or limiting a current of the plurality of switch ICs depending on temperature rise. 【課題】制御装置全体の構成を過度に複雑にすること無く、また、プリント基板の面積を過度に増大させること無く過熱防止を行う。【解決手段】プリント基板上に、抵抗性負荷をハイサイド駆動するための半導体スイッチを含むICパッケージであるスイッチICと、シグナルグランド接続配線と、が配置される。プリント基板上には、複数のスイッチICが配置されている。また、これら複数のスイッチICのハイサイドに共通に接続され、温度上昇に応じて複数のスイッチICの電流を遮断又は制限する機能を有する受動素子を含む過熱防止部品が設けられている。【選択図】図2
Bibliography:Application Number: JP20140088939