SURFACE TREATMENT SUBSTRATE

• Main Authors: TSUDA TOSHIYA, ISHIHARA KAZUHIKO, ICHIJIMA SHINJI
• Format: Patent
• Language: English; Japanese
• Published: 16.11.2015
• Subjects: ADHESIVES; APPARATUS THEREFOR; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; DYES; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PERFORMING OPERATIONS; POLISHES; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a surface treatment substrate capable of suppressing effectively decline of solder wettability generated in the case of long-term storage, by suppressing formation of an oxide film.SOLUTION: A surface treatment substrate has successively from the substrate side on the surface of the substrate, a nickel plating layer containing sulfur atoms as much as 0.01-0.13 wt%, and a treatment film comprising a treatment agent having a hydrophobic group and a hydrophilic group. 【課題】酸化皮膜の形成を抑制することで、長期保管した場合における、はんだ濡れ性の低下を有効に抑制することができる表面処理基材を提供すること。【解決手段】本発明によれば、基材の表面に、基材側から順に、硫黄原子を０．０１〜０．１３重量％で含有するニッケルめっき層と、疎水基および親水基を有する処理剤からなる処理皮膜とを有することを特徴とする表面処理基材を提供する。【選択図】図１