METAL FOIL-CLAD ADHESIVE SHEET, METAL FOIL-CLAD LAMINATE, METAL FOIL-CLAD MULTILAYER SUBSTRATE, CIRCUIT-BOARD PRODUCTION METHOD

• Main Authors: TONBE RIHOKO, FUJINO KENTARO, KONUMA NORIKO
• Format: Patent
• Language: English; Japanese
• Published: 16.11.2015
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide a metal foil-clad adhesive sheet that can also cope with the miniaturization of a wiring pattern of a circuit-board and in addition, can reduce the production cost of the circuit-board also corresponding to the collective lamination molding.SOLUTION: The metal foil-c...