METAL FOIL-CLAD ADHESIVE SHEET, METAL FOIL-CLAD LAMINATE, METAL FOIL-CLAD MULTILAYER SUBSTRATE, CIRCUIT-BOARD PRODUCTION METHOD

• Main Authors: TONBE RIHOKO, FUJINO KENTARO, KONUMA NORIKO
• Format: Patent
• Language: English; Japanese
• Published: 16.11.2015
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide a metal foil-clad adhesive sheet that can also cope with the miniaturization of a wiring pattern of a circuit-board and in addition, can reduce the production cost of the circuit-board also corresponding to the collective lamination molding.SOLUTION: The metal foil-clad sheet comprises a metal foil 2, a release layer 3 provided on the metal foil 2, and an adhesive layer 4 provided on the release layer 3 and formed of a thermosetting resin composition in semi-cured state; and in which, setting the peel strength at the interface between metal foil 2 and release layer 3 as P1 and the peel strength at the interface between release layer 3 and adhesive layer 4 after setting as P2, P1>P2 is satisfied. 【課題】回路基板の配線パターンの微細化にも対応可能であり、しかも一括積層成形にも対応して回路基板の製造コストを低減しうる金属箔付き接着シートを提供する。【解決手段】金属箔２と、金属箔２に設けられた剥離層３と、剥離層３に設けられ、半硬化状態の熱硬化性樹脂組成物で形成された接着層４とを備えている。金属箔２と剥離層３との界面での引き剥がし強度をＰ１とし、剥離層３と硬化後の接着層４との界面での引き剥がし強度をＰ２とした場合、Ｐ１＞Ｐ２である。【選択図】図１