METAL-CLAD LAMINATE, CIRCUIT BOARD AND POLYIMIDE

• Main Authors: SHIBASAKI TAKUYA, KIKUCHI IORI, SUDO YOSHIKI, MORI AKIRA
• Format: Patent
• Language: English; Japanese
• Published: 12.11.2015
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a metal-clad laminate which can cope with requirements of high frequencies of electronic equipment by lowering the dielectric constant and is provided with an insulation resin layer having dielectric characteristics suppressed in temperature dependency, especially an insulation resin layer reduced in temperature dependence of the dielectric loss tangent and a circuit board.SOLUTION: A metal-clad laminate is provided with an insulation resin layer meeting conditions a) to c). Condition a): the Evalue, showing dielectric characteristics at 15 GHz after drying at 100°C for one h, is 0.007 or smaller. Condition b): in the Evalue showing dielectric characteristics at 15 GHz after 24-h humidity conditioning at 23°C and 50% RH, the ratio E/Elies in the range of 1.0-2.0. Condition c): the thermal expansion coefficient lies in the range of 10-30 ppm K. 【課題】低誘電率化によって電子機器の高周波化への対応を可能としつつ、湿度依存性が抑制された誘電特性を有する絶縁樹脂層、特に誘電正接の湿度依存性を低減した絶縁樹脂層を備えた金属張積層体及び回路基板を提供する。【解決手段】 絶縁樹脂層が、構成ａ〜ｃ；ａ）１００℃、１時間の乾燥後の１５ＧＨｚにおける誘電特性を示す指標であるＥ１値が０．００７以下である、ｂ）２３℃、５０％ＲＨの恒温恒湿条件のもと２４時間調湿後の１５ＧＨｚにおける誘電特性を示す指標であるＥ２値において、比Ｅ２／Ｅ１が１．０〜２．０の範囲内である、ｃ）熱膨張係数が１０ｐｐｍ／Ｋ以上３０ｐｐｍ／Ｋ以下の範囲内である、を備えている金属張積層体。【選択図】なし