ELECTROLESS DEPOSITION OF CONTINUOUS PLATINUM LAYER USING COMPLEX Co2+ METAL ION REDUCER
PROBLEM TO BE SOLVED: To provide a solution for electroless deposition of platinum.SOLUTION: A solution for electroless deposition of platinum comprises: a Co2+ concentrated stock solution source 208 containing a Co2+ concentrated stock solution; a Pt4+ concentrated stock solution source 212 contain...
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Main Authors | , , , , , |
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Format | Patent |
Language | English Japanese |
Published |
09.11.2015
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a solution for electroless deposition of platinum.SOLUTION: A solution for electroless deposition of platinum comprises: a Co2+ concentrated stock solution source 208 containing a Co2+ concentrated stock solution; a Pt4+ concentrated stock solution source 212 containing a Pt4+ concentrated stock solution; and a deionized water source 216 containing deionized water. A mixed electrolyte solution 232 of the Co2+ concentration stock solution and the Pt4+ concentration stock solution is formed a flow 220 from the Co2+ concentrated stock solution source 208 joined by a flow 224 from the Pt4+ concentrated stock solution source 212 and a flow 228 from the deionized water source 216. A method for performing electroless plating of platinum includes exposing a wafer 236 to the mixed electrolyte solution 232.
【課題】プラチナの無電解堆積のための溶液を提供する。【解決手段】Co2+濃縮貯蔵液を含有するCo2+濃縮貯蔵液源208と、Pt4+濃縮貯蔵液を含有するPt4+濃縮貯蔵液源212と、脱イオン水を含有する脱イオン水源216とを含む。Co2+濃縮貯蔵液源208からの流れ220が、Pt4+濃縮貯蔵液源212からの流れ224及び脱イオン水源216からの流れ228と合わされ、Co2+濃縮貯蔵液とPt4+濃縮貯蔵液との混合電解質溶液232。混合電解質溶液232に、ウエハ236が暴露されるプラチナの無電解めっきを施す方法。【選択図】図2 |
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Bibliography: | Application Number: JP20150074711 |