ELECTROLESS DEPOSITION OF CONTINUOUS PLATINUM LAYER USING COMPLEX Co2+ METAL ION REDUCER

• Main Authors: YEZDI DORDI, LORETA TAMASAUSKAITE-TAMASIUNAITE, ALDONA JAGMINIENE, ANIRUDDHA JOI, EUGENIJUS NORKUS, INA STANKEVICIENE
• Format: Patent
• Language: English; Japanese
• Published: 09.11.2015
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a solution for electroless deposition of platinum.SOLUTION: A solution for electroless deposition of platinum comprises: a Co2+ concentrated stock solution source 208 containing a Co2+ concentrated stock solution; a Pt4+ concentrated stock solution source 212 containing a Pt4+ concentrated stock solution; and a deionized water source 216 containing deionized water. A mixed electrolyte solution 232 of the Co2+ concentration stock solution and the Pt4+ concentration stock solution is formed a flow 220 from the Co2+ concentrated stock solution source 208 joined by a flow 224 from the Pt4+ concentrated stock solution source 212 and a flow 228 from the deionized water source 216. A method for performing electroless plating of platinum includes exposing a wafer 236 to the mixed electrolyte solution 232. 【課題】プラチナの無電解堆積のための溶液を提供する。【解決手段】Ｃｏ2+濃縮貯蔵液を含有するＣｏ2+濃縮貯蔵液源２０８と、Ｐｔ4+濃縮貯蔵液を含有するＰｔ4+濃縮貯蔵液源２１２と、脱イオン水を含有する脱イオン水源２１６とを含む。Ｃｏ2+濃縮貯蔵液源２０８からの流れ２２０が、Ｐｔ4+濃縮貯蔵液源２１２からの流れ２２４及び脱イオン水源２１６からの流れ２２８と合わされ、Ｃｏ2+濃縮貯蔵液とＰｔ4+濃縮貯蔵液との混合電解質溶液２３２。混合電解質溶液２３２に、ウエハ２３６が暴露されるプラチナの無電解めっきを施す方法。【選択図】図２