POLYAMIDE MOLDING COMPOSITION, PRODUCTION PROCESS OF THE SAME AND USE OF POLYAMIDE MOLDING COMPOSITION

• Main Authors: HOFFMANN BOTHO, LAMBERTS NIKOLAI, PHILIPP HARDER, ANDREAS BAYER, HEWEL MANFRED
• Format: Patent
• Language: English; Japanese
• Published: 09.11.2015
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a polyamide molding composition having a high thermal deflection temperature, high ultimate tensile strength and tensile strain at break as well as improved mechanical characteristics.SOLUTION: There are provided: a polyamide molding composition which comprises the following components: (A) a semi-crystalline semi-aromatic polyamide having a melting point higher than 270°C or a mixture of thereof; (B) a copolymer of an oxiranylacrylate and/or an oxiranylmethacrylate and at least one of other olefinic unsaturated monomer or a mixture of thereof; (C) one or more fiber reinforcements; (D) one or more thermal stabilizers (provided that the ratio of (B) is 1 to 15 mass% based on 100 mass% constituted by the whole of the components and the polyamide molding composition contains no grafted impact resistance modifier); and use thereof; as well as a molded product of the polyamide molding composition. 【課題】高い熱たわみ温度を有するのみならず、高い極限引張強度及び破断点引張ひずみ、並びに改良された機械的特性をも有する、ポリアミド成形組成物を提供する。【解決手段】下記成分：(A)融点が270℃より高い半結晶性の半芳香族ポリアミド、又はこれらのポリアミドの混合物；(B)オキシラニルアクリラート及び／又はオキシラニルメタクリラートと少なくとも1種の他のオレフィン性不飽和モノマーのコポリマー、或いはこれらのコポリマーの混合物；(C)1種以上の繊維強化材；(D)1種以上の熱安定剤；を含んでなるポリアミド成形組成物（(B)の割合は、成分(A)及び(B)の全体で構成される100質量%に基づいて1〜15質量%であり、ポリアミ成形組成物はグラフト化耐衝撃性改質剤を含まないことを条件とする）及びその使用、並びに該ポリアミ成形組成物製の成形品。【選択図】なし