MANUFACTURING METHOD OF LAMINATE STRUCTURE

• Main Authors: BABA SUSUMU, SHIRAHASE KAZUTAKA, NISHIMURA TAKASHI, KOYANAGI HIROSHI
• Format: Patent
• Language: English; Japanese
• Published: 05.11.2015
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminate structure capable of improving adhesiveness between a metal part such as an electroless copper plating layer and a dry film resist.SOLUTION: The manufacturing method of the laminate structure includes: a laminating step of laminating an insulator film and a backing film in this order on a substrate including a metal part in a top face or a second insulator layer including a metal part on a top face; an exfoliating step of exfoliating the backing film from a surface of the insulator film; and a plating step of forming the metal part on the insulator film by plating processing. The backing film includes ruggedness on a surface in contact with the insulator film and after the exfoliating step or before the plating step, the insulator film includes ruggedness on a surface in contact with the backing film, the ruggedness resulting from the ruggedness on the surface of the backing film. 【課題】無電解銅めっき層などの金属部とドライフィルムレジストとの密着性を高めることができる積層構造体の製造方法を提供する。【解決手段】本発明に係る積層構造体の製造方法は、金属部を上面に有する基板又は金属部を上面に有する第２の絶縁層上に、絶縁フィルムと、基材フィルムとをこの順で積層する積層工程と、前記基材フィルムを前記絶縁フィルムの表面から剥離する剥離工程と、前記絶縁フィルム上に、めっき処理により金属部を形成するめっき工程とを備え、前記基材フィルムは、前記絶縁フィルムと接する表面に凹凸を有し、前記剥離工程後かつ前記めっき工程前に、前記基材フィルムの表面の凹凸に由来して、前記絶縁フィルムは、前記基材フィルムと接していた表面に凹凸を有する。【選択図】図１