DATA WRITING SYSTEM, DATA WRITING METHOD, COLLECTIVE CIRCUIT BOARD, AND CIRCUIT BOARD
PROBLEM TO BE SOLVED: To further improve the production efficiency of circuit boards.SOLUTION: A data writing system 1 of the present invention comprises: a plurality of circuit boards 11-18 each including a circuit part that includes a memory in which data can be written and is capable of communica...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English Japanese |
Published |
02.11.2015
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | PROBLEM TO BE SOLVED: To further improve the production efficiency of circuit boards.SOLUTION: A data writing system 1 of the present invention comprises: a plurality of circuit boards 11-18 each including a circuit part that includes a memory in which data can be written and is capable of communicating with the outside; a data transmission device 3 that is capable of communicating with the circuit part in at least one circuit board among the plurality of circuit boards 11-18; and a data writing unit that writes data in a memory. Each circuit part receives prescribed data transmitted by the data transmission device 3 or another circuit board which is included in the plurality of circuit boards 11-18 and in which writing processing of data into the memory is finished, and after completion of writing processing of the received prescribed data into the memory by the data writing unit, transmits all or part of the received prescribed data to another circuit board which is included in the plurality of circuit boards 11-18 and in which writing processing of the data is not performed.
【課題】 回路基板の生産効率をさらに向上させる。【解決手段】 本発明のデータ書込みシステム1は、データを書込み可能なメモリを含み且つ外部と通信可能な回路部をそれぞれが有する複数の回路基板11〜18と、複数の回路基板11〜18内の少なくとも一つの回路基板内の回路部と通信可能なデータ送信装置3と、メモリにデータを書き込むデータ書込み部と、を備える。そして、回路部は、データ送信装置3から、又は、複数の回路基板11〜18に含まれ且つメモリへのデータの書込み処理が終了している他の回路基板から送信される所定のデータを受信し、データ書込み部による受信した所定のデータのメモリへの書込み処理が終了した後、受信した所定のデータの全て又は一部を、複数の回路基板11〜18に含まれ且つデータの書込み処理が行われていない他の回路基板に送信する。【選択図】 図1 |
---|---|
Bibliography: | Application Number: JP20140068965 |