CHEMICAL MECHANICAL POLISHING PAD WITH WINDOW WHICH IS SOFT AND IS CAPABLE OF CONDITIONING

• Main Authors: MICHELLE K JENSEN, JAMES MURNANE, HENDRON JEFFREY J, DAVID B JAMES, MARTY W DEGROOT, YEH FENGJI, JOHN G NOWLAND, QIAN BAINIAN
• Format: Patent
• Language: English; Japanese
• Published: 02.11.2015
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GENERAL PROCESSES OF COMPOUNDING; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

PROBLEM TO BE SOLVED: To provide a polymer terminal point detection window composition having durability desired for a severe polishing usage.SOLUTION: A chemical mechanical polishing pad 10 includes a polishing layer 20 and a window 30 assembled into the polishing layer. Therein, the polishing layer includes a reaction product of a component comprising a polishing layer prepolymer and a polishing layer curing agent system, the polishing layer curing agent system includes a polishing layer amine-initiated polyol curing agent, a polishing layer high-molecular weight polyol curing agent and a polishing layer bifunctional curing agent, the window comprises a reaction product of a component including a window prepolymer and a window curing agent system, the window curing agent system includes a window bifunctional curing agent, a window amine-initiated polyol curing agent and a window high-molecular weight polyol curing agent, and the polishing layer has a density of ≥0.6 g/cm, a Shore D hardness of 5 to 40, a breakage point elongation of 100 to 450% and a cutting speed of 25 to 150 μm/hr. 【課題】厳しい研磨用途に求められる耐久性を有するポリマー終点検出ウィンドウ組成を提示する。【解決手段】研磨層２０と、研磨層に組み込まれたウィンドウ３０とを有し、研磨層が、研磨層プレポリマーと、研磨層硬化剤系とを含む成分の反応生成物を含み、研磨層硬化剤系が、研磨層アミン開始ポリオール硬化剤、研磨層高分子量ポリオール硬化剤及び研磨層二官能硬化剤を含み、ウィンドウが、ウィンドウプレポリマーと、ウィンドウ硬化剤系とを含む成分の反応生成物を含み、ウィンドウ硬化剤系が、ウィンドウ二官能硬化剤、ウィンドウアミン開始ポリオール硬化剤及びウィンドウ高分子量ポリオール硬化剤を含み、研磨層が、 ０．６g/cm3の密度、５〜４０のショアーＤ硬さ、１００〜４５０％の破断点伸び及び２５〜１５０μm/hrの切削速度を示す、ケミカルメカニカル研磨パッド１０が提供される。【選択図】図５