RESIN FILM PROCESSING APPARATUS

• Main Authors: SUDO FUMIHIKO, MIZOZOE TAKAAKI, EZAKI MAKOTO
• Format: Patent
• Language: English; Japanese
• Published: 02.11.2015
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide a resin film processing apparatus capable of stably forming holes in resin film.SOLUTION: A resin film processing apparatus 1 comprises: conveyance means 2 that conveys resin film 20 in its longitudinal direction, and that has a grooved roller 21 whose outer shape is columnar and in which at least one groove is formed in the periphery in a circumferential direction, and which a middle section of the resin film 20 in the longitudinal direction contacts and is wound around to rotate; and hole formation means 3 that is disposed opposite to the grooved roller 21 and has a laser beam irradiation part 31 for forming a hole at an irradiated portion by applying laser beam irradiation to the resin film 20 above the groove. The conveyance means 2 has a holding angle adjustment mechanism 4 which contacts the grooved roller 21 of the resin film 20 in order to adjust a holding angle of a contact part 203 around which the resin film 20 is wound. 【課題】樹脂フィルムに孔を安定して形成することができる樹脂フィルム加工装置を提供すること。【解決手段】樹脂フィルム加工装置１は、樹脂フィルム２０をその長手方向に沿って搬送する搬送手段２であって、外形形状が円柱状をなし、その外周部に周方向に沿って少なくとも１本の溝が形成され、樹脂フィルム２０の長手方向の途中が接触して、掛け回されつつ回転する溝付きローラ２１を有する搬送手段２と、溝付きローラ２１に対向して設けられ、前記溝上で樹脂フィルム２０に対してレーザ光を照射することにより、その照射された部分に孔を形成するレーザ光照射部３１を有する孔形成手段３とを備える。搬送手段２は、樹脂フィルム２０の溝付きローラ２１に接触して、掛け回された接触部２０３の抱き角を調整する抱き角調整機構４を有する。【選択図】図２