SOLDER BALL AND SEMICONDUCTOR DEVICE

• Main Authors: FUJIWARA SHINICHI, IKEDA YASUSHI, CHIWATA NOBUHIKO, WAKANO MOTOKI, FUJIYOSHI MASARU
• Format: Patent
• Language: English; Japanese
• Published: 29.10.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide a solder ball which can prevent disconnection from occurring in a copper pad part while preventing reaction of copper and tin between the copper pad part and the solder ball from being promoted, and to provide a semiconductor device using the solder ball.SOLUTION: A...