SOLDER BALL AND SEMICONDUCTOR DEVICE

• Main Authors: FUJIWARA SHINICHI, IKEDA YASUSHI, CHIWATA NOBUHIKO, WAKANO MOTOKI, FUJIYOSHI MASARU
• Format: Patent
• Language: English; Japanese
• Published: 29.10.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide a solder ball which can prevent disconnection from occurring in a copper pad part while preventing reaction of copper and tin between the copper pad part and the solder ball from being promoted, and to provide a semiconductor device using the solder ball.SOLUTION: A solder ball is configured by including: core material coated with metal on a surface of the metal or resin; a first metal film layer formed on the surface of the core material and comprising nickel, titanium or chromium as a main component; a second metal film layer formed on the outer periphery of the first metal film layer and comprising copper as a main component; and a third metal film layer on the outer periphery of the second metal film layer and comprising tin as a main component. A semiconductor device is configured by connecting a first electrode pad on a first member and a second electrode pad on a second member by using the solder ball. 【課題】銅パッド部とはんだボールとの間における銅と錫との反応が促進されるのを阻止して、銅パッド部に断線が発生するのを防止することを可能にするはんだボール及びそのはんだボールを用いた半導体装置を提供する【解決手段】はんだボールを、金属又は樹脂の表面に金属をコーティングしたコア材と、このコア材の表面に形成されたニッケル、チタンもしくクロムを主成分とする第一の金属膜層と、この第一の金属膜層の外周に形成された銅を主成分とする第二の金属膜層と、この第二の金属膜層の外周に錫を主成分とする第三の金属膜層とを有して構成し、半導体装置を、第一の部材上の第一の電極パッドと第二の部材上の第二の電極パッドとをこのはんだボールを用いて接合した構成とした。【選択図】図１