SEMICONDUCTOR DEVICE

• Main Authors: ONODA KENJI, OMAE SHOICHIRO, KANAMORI ATSUSHI, IWABUCHI AKIRA
• Format: Patent
• Language: English; Japanese
• Published: 22.10.2015
• Subjects: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS; CONTROL OR REGULATION THEREOF; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRICITY; GENERATION

PROBLEM TO BE SOLVED: To reduce inductance of a positive electrode conductor and a negative electrode conductor and increase heat dissipation performance in a semiconductor device including six semiconductor chips which constitute three pairs of upper and lower arms of a three-phase inverter, and the paired positive electrode conductor and negative electrode conductor as conductors connected to a DC power supply.SOLUTION: A semiconductor device comprises two paired power supply terminals, each pair including a positive electrode terminal (31) and a negative electrode terminal (41) which are arranged adjacent to each other in an X direction. A positive electrode conductor (30) has a positive electrode connection part (33) which electrically connects a positive electrode heat sink (32) and the positive electrode terminal and electrically connecting the positive electrode terminals with each other. A negative electrode conductor (40) has a negative electrode connection part (43) which electrically connects a negative electrode heat sink (42) and the negative electrode terminal and electrically connects the negative electrode terminals with each other. At least one of the positive electrode connection part and the negative electrode connection part forms a layered structure with the other conductor via a mold resin part (100) and a plate thickness direction of the connection part which forms the layered structure is assumed to be a thickness direction. 【課題】三相インバータの３つの上下アームを構成する６つの半導体チップと、直流電源に接続される対をなす導体としての正極導体及び負極導体と、を備える半導体装置において、正極導体及び負極導体のインダクタンスを低減するとともに放熱性を向上する。【解決手段】正極端子（３１）と負極端子（４１）とが、Ｘ方向に隣りあって配置されてなる電源端子対を２つ有する。正極導体（３０）は、正極ヒートシンク（３２）と正極端子とを電気的に連結するとともに正極端子同士を電気的に連結する正極連結部（３３）を有する。負極導体（４０）は、負極ヒートシンク（４２）と負極端子とを電気的に連結するとともに負極端子同士を電気的に連結する負極連結部（４３）を有する。正極連結部及び負極連結部の少なくとも一方が、他方の導体との間にモールド樹脂部（１００）を介した積層構造を形成し、該積層構造を形成する連結部の板厚方向が厚み方向とされる。【選択図】図４