POWER MODULE

PROBLEM TO BE SOLVED: To provide a power module having high reliability and heat dissipation performance in a power module bonded by using a sintering metal bonding material.SOLUTION: In a power module 7 which includes an insulating substrate 1 having conductive layers 2 on both surfaces of an insul...

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Bibliographic Details
Main Authors NAKAJIMA YASUSHI, YAMADA TAKAYUKI, BETSUSHIBA NORIYUKI, MURAMATSU YUYA
Format Patent
LanguageEnglish
Japanese
Published 05.10.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a power module having high reliability and heat dissipation performance in a power module bonded by using a sintering metal bonding material.SOLUTION: In a power module 7 which includes an insulating substrate 1 having conductive layers 2 on both surfaces of an insulation layer and a semiconductor element 5 bonded to the conductor layer by a bonding material, a part corresponding to a peripheral part 5b of the semiconductor element is bonded by a bonding material having low Young's modulus and the central part 5a of the semiconductor element is bonded by a sintering metal bonding material 11A. 【課題】焼結性金属接合材を用いて接合されるパワーモジュールであって、信頼性及び放熱性の高いパワーモジュールを提供する。【解決手段】絶縁層の両面に導体層２を備える絶縁基板１と導体層に接合材により接合した半導体素子５を備えたパワーモジュール７であって、半導体素子の周縁部５ｂに対応した部分はヤング率の低い接合材で、半導体素子の中心部５ａでは焼結性金属接合材１１Ａで接合されている。【選択図】図１Ｂ
Bibliography:Application Number: JP20140055207