SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSING METHOD

• Main Authors: TOJIMA JIRO, ITO KIKO
• Format: Patent
• Language: English; Japanese
• Published: 05.10.2015
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a substrate liquid processing apparatus which processes a substrate without disturbing airflow around the substrate and flexibly deals with operations such as dummy dispensation or scanning.SOLUTION: A substrate liquid processing apparatus includes: a substrate holding part; a rotation driving part which rotates the substrate holding part; a recovery cup which receives and recovers a process liquid; a process liquid nozzle (412) which supplies the process liquid to the substrate (W); a nozzle arm (410) which holds the process liquid nozzle; and a nozzle arm driving mechanism (413) which drives the nozzle arm so that the nozzle arm moves between a process position, at which the process liquid nozzle faces in a direction of the substrate, and a retreat position retreated from the process position. When the nozzle arm is in the process position, the process liquid nozzle is located at the outer side relative to a periphery of the substrate (W) in a radial direction and discharges the process liquid to the substrate. 【課題】基板周囲の気流を乱すことなく基板を処理することができ、かつ、ダミーディスペンス若しくはスキャン動作等の操作に柔軟に対応することができる基板液処理装置の提供。【解決手段】基板処理装置は、基板保持部と、基板保持部を回転させる回転駆動部と、処理液を受け止めて回収する回収カップと、基板（Ｗ）に処理液を供給する処理液ノズル（４１２）と、処理液ノズルを保持するノズルアーム（４１０）と、処理液ノズルを、当該処理液ノズルが基板の方向を向いた処理位置と、処理位置から退避した退避位置との間で移動させるように前記ノズルアームを駆動するノズルアーム駆動機構（４１３）と、を備える。処理位置にあるとき、処理液ノズルが基板（Ｗ）の周縁よりも半径方向外側に位置して基板に向けて処理液を吐出する。【選択図】図２