CONDUCTIVE INK COMPOSITION, METHOD OF PRODUCING CONDUCTIVE PATTERN, AND CONDUCTIVE CIRCUIT
PROBLEM TO BE SOLVED: To provide a conductive ink composition which has low viscosity and excellent printability and is capable of giving a wiring pattern whose high conductivity does not change before and after a high-temperature and high-humidity history.SOLUTION: The conductive ink composition fo...
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Main Authors | , |
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Format | Patent |
Language | English Japanese |
Published |
01.10.2015
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a conductive ink composition which has low viscosity and excellent printability and is capable of giving a wiring pattern whose high conductivity does not change before and after a high-temperature and high-humidity history.SOLUTION: The conductive ink composition for wiring contains a conductive filler, a thermosetting resin composition, and an organic solvent as essential components and further contains a (meth)acrylic resin having a number-average molecular weight of 5,000-20,000 and an amine value of 15 mgKOH/g or more. A method of producing a conductive pattern for wiring applies the conductive ink composition for wiring onto a non-heat-resistant substrate and heats it.
【課題】低粘度で印刷適性に優れ、高温高湿の履歴の前後において、高い導電性が変化しない配線パターンを得ることができる導電性インキ組成物を提供することにある。【解決手段】導電性フィラー、熱硬化性樹脂組成物、有機溶剤を必須成分として含有する導電性インキ組成物において、更に、数平均分子量5,000〜20,000でありかつアミン価15mgKOH/g以上の(メタ)アクリル系樹脂を含有することを特徴とする配線用導電性インキ組成物及び当該配線用導電性インキ組成物を、非耐熱性基材上に塗布し加熱する配線用導電性パターンの製造方法。【選択図】図1 |
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Bibliography: | Application Number: JP20140047521 |