WIRING BOARD, MANUFACTURING METHOD THEREOF, AND WIRING BOARD MEMBER

• Main Authors: MIURA YOICHI, UMEDA KAZUO, TAKAMIZAWA HIDEYOSHI, YOSHIOKA HIDENORI, SHIMOMURA TAKESHI
• Format: Patent
• Language: English; Japanese
• Published: 28.09.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a wiring board having a base layer capable of attaining significant cost reduction.SOLUTION: A wiring board includes: a base layer which is made from an inorganic material and is provided with a plurality of holes passing through from a first surface to a second surface; vertical-direction conductors disposed inside each of holes of the base layer so as to have lower surfaces and upper surfaces; first and second insulation layers provided on the first surface and the second surface, respectively; a plurality of first insulation layer through conductors which pass through the first insulation layer to come into contact with each lower surface of the partial vertical-direction conductors of the vertical-direction conductors and are provided not to come into contact with the lower surfaces of the vertical-direction conductors other than the partial vertical-direction conductors; a plurality of second insulation layer through conductors which pass through the second insulation layer to come into contact with each of the upper surfaces of the partial vertical-direction conductors of the vertical-direction conductors and are provided not to come into contact with the upper surfaces of the vertical-direction conductors other than the partial vertical-direction conductors; and first and second wiring patterns provided on each of the first and second insulation layers to come into contact with each of the first and second insulation through conductors. 【課題】その有する基層として大きなコスト削減を達成できる配線板を提供すること。【解決手段】第１面から第２面に貫通する孔が複数設けられた無機材料製の基層と、下面と上面とを有するように基層の孔それぞれの内部に配置された縦方向導電体と、第１、第２面上にそれぞれ設けられた第１、第２の絶縁層と、第１の絶縁層を貫通して、縦方向導電体のうちの一部の縦方向導電体の下面にそれぞれ接触する一方で、該一部を除く縦方向導電体の下面に対しては接触することなく設けられている複数の第１絶縁層貫通導体と、第２の絶縁層を貫通して、縦方向導電体のうちの一部の縦方向導電体の上面にそれぞれ接触する一方で、該一部を除く縦方向導電体の上面に対しては接触することなく設けられている複数の第２絶縁層貫通導体と、第１、第２絶縁層貫通導体にそれぞれ接触して前記第１、第２の絶縁層上にそれぞれ設けられた第１、第２の配線パターンとを具備する。【選択図】図１