WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD

• Main Authors: KUSAMA YASUHIKO, TAMITSU HIDEYUKI, KAWAI KENJI, MIYASAKA FUMIHISA
• Format: Patent
• Language: English; Japanese
• Published: 28.09.2015
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a wiring board in which electrical reliability when a plurality of electronic components are arranged inside one through hole is improved; and provide a manufacturing method of the wiring board.SOLUTION: A wiring board comprises: a core layer in which a through hole is formed and which has projections projecting from an inner wall of the through hole to the inside of the through hole in planar view at boundaries of a plurality of unit arrangement regions provided inside the through hole next to each other; a plurality of electronic components which are stored in the plurality of unit arrangement regions inside the through hole, respectively, in a state of being separated from each other by the projections; and a resin layer filled inside the through hole and holds at least lateral faces of the electronic components. 【課題】複数の電子部品を１つの貫通孔の内部に配設する際の電気的信頼性を向上させた配線基板、及び、配線基板の製造方法を提供することを課題とする。【解決手段】配線基板は、貫通孔が形成され、前記貫通孔の内部に並べて設けられる複数の単位配置領域の境界部において、前記貫通孔の内壁から平面視で前記貫通孔の内側に突出する突出部を有するコア層と、前記貫通孔の内部で、前記突出部によって互いに離間された状態で、前記複数の単位配置領域にそれぞれ収容される複数の電子部品と、前記貫通孔の内部に充填され、前記電子部品の少なくとも側面を保持する樹脂層とを含む。【選択図】図１