HIGHLY THERMAL CONDUCTIVE RESIN COMPOSITION

• Main Authors: HAYAKAWA OSAMU, NAM PHAM HOAI, NODA MINEYUKI
• Format: Patent
• Language: English; Japanese
• Published: 28.09.2015
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a composition having excellent thermal conductivity and high electrical insulating properties, and having excellent flexibility, in comparison to a ceramic molded body and a thermosetting resin composition.SOLUTION: The resin composition is provided which contains 20-60 vol.% of thermoplastic resin and 40-80 vol.% of boron nitride. The boron nitride is made up of spherical boron nitride particles and flat boron nitride particles. The spherical boron nitride particle has an average particle size of 50-300 μm and an aspect ratio of 1-2. The flat boron nitride particle has an average particle size of 8-100 μm and an aspect ratio of 30-300. The volume ratio of the spherical boron nitride particles to the total amount of boron nitride is 75-99 vol.%. A molded product formed from the composition is also provided. 【課題】本発明は、優れた熱伝導性と高絶縁性とを有し、セラミック成形体や熱硬化性樹脂組成物に比べて、優れた柔軟性を有する組成物を提供することを課題とする。【解決手段】本発明は、２０〜６０体積％の熱可塑性樹脂と、４０〜８０体積％の窒化ホウ素とを含む樹脂組成物であって、前記窒化ホウ素は、球状窒化ホウ素粒子と扁平状窒化ホウ素粒子とから構成され、前記球状窒化ホウ素粒子は、平均粒径が５０〜３００μｍでありアスペクト比が１〜２であり、前記扁平状窒化ホウ素粒子は、平均粒径が８〜１００μｍでありアスペクト比が３０〜３００であり、前記窒化ホウ素全量に対する前記球状窒化ホウ素粒子の体積比率が、７５体積％〜９９体積％であることを特徴とする樹脂組成物および、この組成物から成形された成形品である。【選択図】図２