ELECTRONIC APPARATUS

• Main Authors: ITO HARUHITO, KATO TAISHI, SUGIURA JUNJI
• Format: Patent
• Language: English; Japanese
• Published: 07.09.2015
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To reduce a cost of manufacture and to improve connection reliability in an electronic apparatus in which a first region and a second region are separately formed.SOLUTION: The electronic apparatus includes: a first region (14) in which a main circuit (18) that implements a predetermined function is formed; and a second region (16) for forming an additional circuit (42) that adds a function to the predetermined function. These regions are provided on a common multilayer substrate (12) in which conductors (12b) are disposed while being multilayered, and provided separately within a plane orthogonal to a lamination direction of the conductors. The first region includes first wiring (28) for electrically connecting the main circuit with the additional circuit, and a connection part (30) which is electrically connected with the first wiring and disposed over all the layers in which the conductors are provided, in an end neighboring to the second region in order to connect the first wiring even with the conductor in any layer. The main circuit is electrically connectable with the additional circuit via the first wiring and the connection part. 【課題】第１領域と第２領域とが分けて構成される電子装置において、製造コストを低減し、且つ、接続信頼性を向上する。【解決手段】電子装置は、所定機能を実現する主回路（１８）が形成された第１領域（１４）と、所定機能に対して機能を追加する追加回路（４２）を形成するための第２領域（１６）を有する。これら領域は、導体（１２ｂ）が多層に配置された共通の多層基板（１２）に設けられるとともに、導体の積層方向に直交する面内において分けて設けられている。第１領域は、主回路を追加回路と電気的に接続するための第１配線（２８）と、該第１配線と電気的に接続されるとともに、第１配線をいずれの層の導体とも接続可能とするために、第２領域に隣接する端部において導体が設けられた全ての層にわたり配置された接続部（３０）を有する。主回路は、第１配線及び接続部を介して、追加回路と電気的に接続可能となっている。【選択図】図３