POWER CONVERSION DEVICE
PROBLEM TO BE SOLVED: To save a labor for an assembly process of a power conversion device.SOLUTION: The power conversion device includes: a power semiconductor module; a casing which includes a coolant channel and an opening communicating to the coolant channel and in which the power semiconductor...
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Main Authors | , , , |
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Format | Patent |
Language | English Japanese |
Published |
24.08.2015
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To save a labor for an assembly process of a power conversion device.SOLUTION: The power conversion device includes: a power semiconductor module; a casing which includes a coolant channel and an opening communicating to the coolant channel and in which the power semiconductor module inserted from the opening into the coolant channel is cooled by housing the power semiconductor module; a mounting member that is different from the power semiconductor module and the casing for mounting the power semiconductor module to the casing; and a sealing member which is brought into press-contact with a surface of the casing in the vicinity of the opening in the state where the power semiconductor module is mounted to the casing by the mounting member, for sealing the coolant channel. The mounting member includes a first mounting part for mounting the mounting member to the power semiconductor module and a second mounting part for mounting the mounting member to the casing.
【課題】電力変換装置の組み立て工程を省力化する。【解決手段】電力変換装置は、パワー半導体モジュールと、冷媒流路と冷媒流路に連通する開口とを有し、開口から冷媒流路へ挿入されたパワー半導体モジュールを収納してパワー半導体モジュールを冷却する筐体と、パワー半導体モジュールおよび筐体とは異なる部材であって、パワー半導体モジュールを筐体に取り付ける取付部材と、パワー半導体モジュールが取付部材で筐体に取り付けられた状態で、開口の近傍の筺体の面に押圧接触されて冷媒流路を密閉する密閉部材とを備え、取付部材は、パワー半導体モジュールに取付部材を取り付ける第1の取付部と、取付部材を筐体に取り付ける第2の取付部とを有する。【選択図】図12 |
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Bibliography: | Application Number: JP20140024236 |