RELEASE FILM FOR MOLDING

• Main Authors: IKEO SATOSHI, NAKATANI SHINYA, KANENO YUJI, KIKUCHI HIROSHI
• Format: Patent
• Language: English; Japanese
• Published: 24.08.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a release film for molding capable of easily preventing components from being damaged and resin from leaking in a molding step even in the case where there is variance based on a tolerance, for example, in heights of the components when manufacturing an externally exposed semiconductor package in which the components are partially exposed from a mold resin to the outside.SOLUTION: A release film 1 for molding is characterized in presenting both plastic deformation and elastic deformation behaviors in a direction of compression at a mold process temperature ranging from 100 to 250°C. The variance in the heights of the components is absorbed by plastically deforming the release film 1 for molding, such that an excessive pressure is prevented from acting on the components. Further, since the elastic deformation behavior is presented even after the plastic deformation, the resin may also be prevented from leaking. 【課題】構成部品の一部がモールド樹脂から外部に露出する外部露出型半導体パッケージを製造するに際して、構成部品の高さに、例えば公差に基づくバラつきがある場合でも、モールド工程において、構成部品の破損および樹脂モレが生じるのを容易に防止することのできるモールド用離型フィルムを提供する。【解決手段】モールド用離型フィルム１は、１００〜２５０℃であるモールドプロセス温度において、圧縮方向で塑性変形と弾性変形の双方の挙動を示すことを特徴とする。構成部品の高さのバラつきをモールド用離型フィルム１が塑性変形することで吸収して、構成部品に過大な押圧力が作用しないようにする。また、塑性変形した後でも弾性変形の挙動を示すので、樹脂モレも回避できる。【選択図】図３