INFRARED DETECTION DEVICE

PROBLEM TO BE SOLVED: To cut down manufacturing costs and reduce the number of components in an infrared detection device equipped with a function to detect an object radiating an infrared ray.SOLUTION: The infrared detection device comprises: a first semiconductor substrate (12) having an infrared...

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Bibliographic Details
Main Authors YAMASHITA SHUICHI, SUZUKI YOSHIMI, YOSHIDA TAKAHIKO, WADO HIROYUKI
Format Patent
LanguageEnglish
Japanese
Published 24.08.2015
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Summary:PROBLEM TO BE SOLVED: To cut down manufacturing costs and reduce the number of components in an infrared detection device equipped with a function to detect an object radiating an infrared ray.SOLUTION: The infrared detection device comprises: a first semiconductor substrate (12) having an infrared detection element (20) formed on one surface (12a) side and including, as the infrared detection element, at least one of object detection elements (20a, 20ab) for detecting an infrared ray radiated from an object (106); and a second semiconductor substrate (14) formed using a material that transmits an infrared ray and having a light focusing part (24) for focusing the infrared ray radiated from the object on the object detection element. The second semiconductor substrate is disposed on one surface of the first semiconductor substrate, and the first and second semiconductor substrates are joined together so that a prescribed interval for focusing light is placed between the object detection element and the light focusing part. 【課題】赤外線を放射する物体の検出機能を備えた赤外線検出装置において、製造コストを低減し、且つ、部品点数を低減する。【解決手段】赤外線検出装置は、一面(12a)側に赤外線検出素子(20)が形成され、該赤外線検出素子として、物体(106)から放射される赤外線を検出する物体検出素子(20a,20ab)を少なくとも1つ含む第1半導体基板(12)と、赤外線を透過する材料を用いて形成され、物体から放射される赤外線を物体検出素子に対して集光するための集光部(24)を有する第2半導体基板(14)と、を備える。第1半導体基板の一面上に、第2半導体基板が配置され、物体検出素子と集光部との間に集光のための所定間隔を有するように、第1半導体基板と第2半導体基板とが接合されている。【選択図】図4
Bibliography:Application Number: JP20140023936