TOUCH PANEL SENSOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

• Main Authors: MOMOSE KENJI, HINOKIBAYASHI YASUHIRO, KISHIRO FUKASHI
• Format: Patent
• Language: English; Japanese
• Published: 20.08.2015
• Subjects: CALCULATING; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; PHYSICS

PROBLEM TO BE SOLVED: To provide a touch panel sensor substrate and a method for manufacturing the touch panel sensor substrate, for preventing disconnection or short circuits of an extraction wiring line caused by increase in film thickness of a decorative layer formed on the touch panel sensor substrate.SOLUTION: A method for manufacturing an electrostatic capacitance type touch panel sensor substrate is provided, including steps of: forming a decorative layer to film thickness of 5 μm or more; forming a connecting part to connect first wiring lines by using a transparent conductive material; forming a decorative protective layer by using a transparent resin composition and by screen printing in such a manner that an angle between the surface of the decorative protective layer and a front plate is 2 degrees or more and 15 degrees or less; forming an insulating layer by using a transparent resin composition; forming an extraction wiring line by using a metal material; and forming the first wiring line and a second wiring line by using a transparent conductive material. 【課題】タッチパネルセンサー基板に形成される加飾部層の厚膜化による取出配線の断線・短絡を防止する、タッチパネルセンサー基板とその製造方法を提供する。【解決手段】静電容量式タッチパネルセンサー基板の製造方法は、加飾部層を５μｍ以上の膜厚で形成する工程と、第１の配線を結ぶ接続部を、透明導電材料を用いて形成する工程と、加飾部保護層を、加飾部保護層の表面と前面板のなす角度が２度以上かつ１５度以下となるように透明樹脂組成物を用いてスクリーン印刷にて形成する工程と、絶縁層を、透明樹脂組成物を用いて形成する工程と、取出配線を、金属材料を用いて形成する工程と、第１の配線および第２の配線を、透明導電材料を用いて形成する工程とを備える【選択図】図３