AUTOMATIC VISUAL INSPECTION APPARATUS

• Main Authors: OKA KOHEI, OKUBO KENJI, OMI HIDEKAZU
• Format: Patent
• Language: English; Japanese
• Published: 20.08.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

PROBLEM TO BE SOLVED: To provide an automatic visual inspection apparatus for observing and inspecting the appearances of chips arrayed and formed on a wafer, capable of performing accurate quality determination with respect to various abnormal modes, while eliminating influence of imaging luminance difference among inspection object regions even when each inspection object region has a different imaging luminance.SOLUTION: A wafer visual inspection apparatus is an apparatus for observing and inspecting appearances of chips arrayed and formed on a wafer using an average brightness, a brightness dispersion value, and a brightness CV value of an observed image as inspection parameters. 【課題】 ウエハー上に配列形成されたチップの外観を観察して検査する装置において、検査対象部位毎に撮像輝度が異なる場合であっても、検査対象部位の撮像輝度の違い影響を受けることなく、種々の異常モードに対し正確な良否判定を行うことができる、自動外観検査装置を提供する。【解決手段】 ウエハー上に配列形成されたチップの外観を観察して検査する装置であって、観察画像の輝度平均値、輝度分散値、輝度ＣＶ値を検査パラメータとする、ウエハー外観検査装置である。【選択図】 図１