COMPOSITION AND METHOD FOR PRODUCING COMPOSITE MATERIAL

• Main Authors: SAKAI NOBUSHI, OSACHI TAKESHI
• Format: Patent
• Language: English; Japanese
• Published: 06.08.2015
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a method for producing, by an optical imprint lithography, an optically-resistant and less-colored composite material including a substrate and an optically cured layer.SOLUTION: A method for producing a composite material comprises: a step "a" for forming a photocurable composition layer 2 on a substrate 1 or mold 3 which is substantially transparent to visible light, and in which the transmittance of light of wavelengths in an entire wavelength region less than 370 nm is 10% or less, provided that the photocurable composition layer includes a liquid photocurable composition including a compound having at least one photopolymerizable group, and a photopolymerization initiator which acts as a polymerization initiator of the compound having at least one photopolymerizable group in response to light of a wavelength region of 370 nm or longer, and which has the feature of the absorption intensity of a visible light region decreasing with the change in structure; a step "b" for holding the photocurable composition layer 2 by the substrate 1 and the mold 3 therebetween; a step "c" for exposing the photocurable composition layer 2 to light of a wavelength region of 370 nm or longer from the side of the substrate 1 to form a light-cured layer during which the photocurable composition layer remains sandwiched by the substrate 1 and the mold 3; and a step "d" for removing the mold 3 from the light-cured layer. 【課題】光インプリントリソグラフィにより、基板と光硬化層とからなり耐光性を有し着色が少ない複合体を製造する方法の提供。【解決手段】可視光に対して実質的に透明で３７０ｎｍ未満の波長領域の全領域における各波長の光の透過率が１０％以下である基板１又はモールド３上に、少なくとも１つの光重合性基を有する化合物と、３７０ｎｍ以上の波長領域の光に感光して光重合性基を有する化合物の重合開始剤として作用すると共に構造が変化して可視光領域にある吸収強度が減少する特性を有する光重合開始剤とを含有する液状の光硬化性組成物からなる光硬化性組成物層２を形成する工程ａ、基板１及びモールド３で光硬化性組成物層２を挟み込む工程ｂ、基板１及びモールド３で挟み込まれた状態のままの光硬化性組成物層２を基板１側から３７０ｎｍ以上の波長領域を含む光で露光して光硬化層とする工程ｃ、この光硬化層からモールド３を離型する工程ｄとを有する。【選択図】図１