COUPLING METHOD

• Main Author: OSHIMA MASANORI
• Format: Patent
• Language: English; Japanese
• Published: 03.08.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a coupling method in which inclination of a first member to a second member is suppressed.SOLUTION: In a coupling method for coupling a first member (10) and a second member (50) through solder (70), confronting faces (43, 44) of the first member to the second member are divided into solder-adhering areas (43a, 44a) under solid state and solder-non-adhering areas (43b, 44b) under liquid state. And the adhering areas are comparted into plural unit areas (43c, 44c) by the non-adhering areas. Solder having the same height is formed in each of the plural unit areas. The solder is brought into contact with the second member to determine the relative position, and the solder is set to the liquid state again, whereby the first member and the second member are connected to each other by the liquid-state solder. Then, the solder is set to a solid state again to couple the first member and the second member through the solder. 【課題】第２部材に対する第１部材の傾きの抑制された接合方法を提供する。【解決手段】第１部材（１０）と第２部材（５０）とを半田（７０）を介して接合する接合方法。第１部材における第２部材との対向面（４３，４４）を、液体状態の半田の付着する付着領域（４３ａ，４４ａ）、および、液体状態の半田の付着しない非付着領域（４３ｂ，４４ｂ）に分け、非付着領域によって付着領域を複数の単位領域（４３ｃ，４４ｃ）に区画する。複数の単位領域それぞれに同一の高さの半田を形成する。半田を第２部材に接触させることで相対位置を決定し、半田を再び液体状態にさせることで第１部材と第２部材とを液体状態の半田によって連結する。そして半田を再び固体状態とすることで第１部材と第２部材とを半田を介して接合する。【選択図】図８