COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

• Main Authors: YAMASHITA DAISUKE, TORII TAKUYA, INOUE MASAHIRO
• Format: Patent
• Language: English; Japanese
• Published: 03.08.2015
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a component built-in wiring board having excellent reliability by preventing adhesion between a core substrate and a wiring lamination part from being deteriorated.SOLUTION: A component built-in wiring board includes a core substrate 11, components 100 and 101, a resin filler 93 and a wiring lamination part. The components 100 and 101 are housed in a plurality of housing hole parts 90 and 91, respectively, in the state that a core principal surface and a component principal surface are directed on the same side. The resin filler 93 is filled in a space between the inner wall surfaces 92 of the housing hole parts 90 and 91 and component side surfaces 104. The core substrate 11 has a bridge part 61 positioned between the adjacent housing hole parts 90 and 91 and an outer peripheral part 62 in which a rear surface side conductor layer 81 is formed. An insular layer 241 independent from the rear surface side conductor layer 81 and projected at the same height as the surface of the rear surface side conductor layer 81 is formed in the core rear surface 13 of the bridge part 61. A space S2 between the rear surface side conductor layer 81 and the insular layer 241 is filled with a part of the resin filler 93. 【課題】コア基板と配線積層部との密着力の低下を防止することにより、信頼性に優れた部品内蔵配線基板を提供すること。【解決手段】部品内蔵配線基板は、コア基板１１、部品１００，１０１、樹脂充填材９３及び配線積層部を備える。部品１００，１０１は、コア主面と部品主面とを同じ側に向けた状態で複数の収容穴部９０，９１にそれぞれ収容される。樹脂充填材９３は、収容穴部９０，９１の内壁面９２と部品側面１０４との隙間に充填される。また、コア基板１１は、隣接する収容穴部９０，９１間に位置するブリッジ部６１と、裏面側導体層８１が形成された外周部６２とを有する。ブリッジ部６１のコア裏面１３には、裏面側導体層８１から独立し、かつ裏面側導体層８１の表面と同じ高さに突出する島状層２４１が形成される。裏面側導体層８１と島状層２４１との隙間Ｓ２は、樹脂充填材９３の一部で埋められる。【選択図】図２