MANUFACTURING METHOD FOR MOUNTING BODY, AND ANISOTROPIC CONDUCTIVE FILM

• Main Authors: KUMAKURA SUSUMU, YAMADA YASUNOBU, SEKIGUCHI MORIO
• Format: Patent
• Language: English; Japanese
• Published: 27.07.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONDUCTORS; CURRENT COLLECTORS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; LINE CONNECTORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES

PROBLEM TO BE SOLVED: To provide a manufacturing method of a mounting body which can ensure high connection reliability while facilitating the rework, and to provide an anisotropic conductive film.SOLUTION: The manufacturing method of a mounting body includes a mounting step for mounting an electronic member on a wiring board, via the anisotropic conductive film, containing a binder principally composed of epoxy resin, and conductive particles having a compression hardness K value of 500 kgf/mmor more during 10% compressive deformation, where the thickness A of the binder and the average particle size B of the conductive particles satisfy a relation 0.6≤B/A≤1.5, and the modulus of elasticity of the binder at 100°C after hardening is 50 MPa or more, and a remounting step for performing the mounting step by reusing the wiring board, upon occurrence of an inconvenient mounting in the mounting step, by peeling the wiring board and electronic member mechanically. 【課題】リワーク作業を容易にするとともに、高い接続信頼性を得ることができる実装体の製造方法、及び異方性導電フィルムを提供する。【解決手段】エポキシ樹脂を主成分とするバインダーと、１０％圧縮変形時の圧縮硬さＫ値が５００ｋｇｆ／ｍｍ2以上である導電性粒子とを含有し、バインダーの厚みＡと導電性粒子の平均粒子径Ｂとの関係が、０．６ Ｂ／Ａ １．５であり、バインダーの硬化後の１００℃における弾性率が、５０ＭＰａ以上である異方性導電フィルムを介して、配線板上に電子部材を実装する実装工程と、実装工程における実装に不都合が生じた場合、前記配線板と前記電子部材とを機械的に引き剥がし、該配線板を再利用して実装工程を行う再実装工程とを有する。【選択図】なし