CIRCUIT BOARD, CIRCUIT BOARD FORMATION DEVICE AND CIRCUIT BOARD FORMATION METHOD

PROBLEM TO BE SOLVED: To achieve a parallel PAM (Pulse Amplitude Modulation) control method and a simple PAM control method by one kind of substrate.SOLUTION: A circuit board comprises: a converter circuit which includes a first wiring pattern 11a for serially connecting a first inductance L1, a fir...

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Bibliographic Details
Main Authors KUHARA MASAKAZU, TANAKA SHINICHI, SATO TAKESHI
Format Patent
LanguageEnglish
Japanese
Published 23.07.2015
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Summary:PROBLEM TO BE SOLVED: To achieve a parallel PAM (Pulse Amplitude Modulation) control method and a simple PAM control method by one kind of substrate.SOLUTION: A circuit board comprises: a converter circuit which includes a first wiring pattern 11a for serially connecting a first inductance L1, a first diode D1 and a second wiring pattern for serially connecting a second inductance L2 and a second diode D2, switching elements IGBT1, IGBT2 connected to the first wiring pattern 11a and the second wiring pattern 11b and a control part 12; and ground patterns GND connected by a common land. The first wiring pattern 11a and the second wiring pattern 11b are formed to have substantially the same width. The first wiring pattern 11a is divided so as to leave predetermined room and the second wiring pattern 11b is divided so as to leave predetermined room and a ground pattern GND is arranged on a region of each predetermined room left by division. The divided first wiring patterns 11a are connected with each other and the divided second wiring patterns are connected with each other by jumper lines 13a, 13b, respectively. 【課題】1種類の基板で並列PAM制御方式と簡易PAM制御方式を実現すること。【解決手段】コンバータ回路は、第1インダクタンスL1と第1ダイオートD1とを直列に接続する第1配線パターン11aと、第2インダクタンスL2と第2ダイオードD2とを直列に接続するための第2配線パターン11bと、それらに接続されるスイッチング素子IGBT1,IGBT2と、制御部12とによって構成され、グランドパターンGNDは共通のランドで接続され、第1配線パターン11a及び第2配線パターン11bは、略同じ幅に形成され、第1配線パターン11aが所定間隔空くよう分割され、第2配線パターン11bが所定間隔空くよう分割され、それぞれ分割された所定間隔の領域にグランドパターンGNDが配置され、分割された第1配線パターン11a同士と、第2配線パターン11b同士がジャンパー線13a,13bで接続される。【選択図】図2
Bibliography:Application Number: JP20140003454