PRINTED-CIRCUIT BOARD

• Main Authors: ISHINO SATOSHI, IKEMOTO NOBUO, KIMURA IKUHEI, SAITO MIKIKO, DOKAI TAKEYA, KATAYA TAKESHI, KATO NOBORU
• Format: Patent
• Language: English; Japanese
• Published: 23.07.2015
• Subjects: CALCULATING; COMPUTING; COUNTING; HANDLING RECORD CARRIERS; PHYSICS; PRESENTATION OF DATA; RECOGNITION OF DATA; RECORD CARRIERS

PROBLEM TO BE SOLVED: To improve bond strength of a radio IC device for a printed-circuit board.SOLUTION: A printed-circuit board 20 comprises: a radio IC device 1 with a feeding circuit board 10 having a radio IC 5 processing a transmit and receive signal and a feeding circuit connected to the radio IC 5; and emission plates 21a and 21b which are electromagnetic field-bound to the feeding circuit. The radio IC device 1 is provided with electrodes 18a and 18b for mounting which are not connected to the feeding circuit electrically, and is fixed to the printed-circuit board 20 by the electrodes 18a and 18b for mounting. The feeding circuit board 10 has electrodes 19a and 19b for emission which are electromagnetic field-bound with the emission plates 21a and 21b built-in. 【課題】プリント配線基板に対する無線ＩＣデバイスの接合強度を向上させること。【解決手段】送受信信号を処理する無線ＩＣ５、及び、該無線ＩＣ５に接続された給電回路を有する給電回路基板１０を備えた無線ＩＣデバイス１と、前記給電回路に電磁界結合された放射板２１ａ，２１ｂと、を備えたプリント配線基板２０。無線ＩＣデバイス１には、前記給電回路とは電気的に接続されていない実装用電極１８ａ，１８ｂが設けられており、無線ＩＣデバイス１は、実装用電極１８ａ，１８ｂによってプリント配線基板２０に固定されている。給電回路基板１０には、放射板２１ａ，２１ｂと電磁界結合された給電用電極１９ａ，１９ｂが内蔵されている。【選択図】図２８