DEVICE, SYSTEM AND METHOD FOR INSPECTING DEFECT IN BLIND HOLE OF CIRCUIT BOARD

• Main Authors: WANG GUANGXIA, CHEN HUEI YU
• Format: Patent
• Language: English; Japanese
• Published: 23.07.2015
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; TESTING

PROBLEM TO BE SOLVED: To provide a device, system and method for inspecting a defect in a blind hole of a circuit board, capable of effectively visually inspecting the conductive contact of a blind hole bottom.SOLUTION: A method for inspecting a defect in a blind hole of a circuit board comprises the steps of: irradiating a circuit board to be measured with irradiating light having a non-visible light wavelength band (S101); capturing image data of the circuit board to be measured (S103); discriminating the outline of the blind hole bottom on the basis of the image data (S105); determining whether a defect is in the area of the blind hole bottom on the basis of the outline (S107); and outputting the determined result (S109). 【課題】めくら孔底部の導電接点の外観検査を効果的に行う回路基板のめくら孔内の欠陥の検査装置、検査システム及びその検査方法を提供する。【解決手段】回路基板のめくら孔内の欠陥検査方法は、不可視光波長帯域の照射光を被測定回路基板に照射するステップＳ１０１と、被測定回路基板の画像データをキャプチャするステップＳ１０３と、画像データに基づいてめくら孔底部の輪郭を識別するステップＳ１０５と、輪郭に基づいてめくら孔底部の領域に欠陥があるか否かを判断するステップＳ１０７と、判断結果を出力するステップＳ１０９とを含む。【選択図】図６