SEMICONDUCTOR DEVICE

• Main Authors: OKUMURA TOMOMI, FUKUTANI KEITA, HIRANO TAKAHIRO, NISHIHATA MASAYOSHI, KADOGUCHI TAKUYA
• Format: Patent
• Language: English; Japanese
• Published: 16.07.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing stress concentration to a recess for ensuring a creeping distance.SOLUTION: A semiconductor device of the present embodiment comprises: a semiconductor element arranged on a plane surface; an encapsulation resin for encapsulating the semiconductor element; a plurality of terminals which are electrically connected with the semiconductor element and each includes a part projecting from a predetermined surface of the encapsulation resin; and a recess having a shape which dents from the predetermined surface toward the semiconductor element side when viewed from a direction perpendicular to the plane surface. When viewed from the direction perpendicular to the plane surface, a side of the recess on the semiconductor element side has an R shape. 【課題】沿面距離を確保する凹部への応力集中を緩和可能な半導体装置を提供する。【解決手段】本半導体装置は、平面上に配された半導体素子と、前記半導体素子を封止する封止樹脂と、前記半導体素子と電気的に接続され、前記封止樹脂の所定の面から突出する部分を備えた複数の端子と、前記平面に垂直な方向から視て、前記所定の面から前記半導体素子側に窪んだ形状の凹部と、を有し、前記平面に垂直な方向から視て、前記凹部の前記半導体素子側の辺はＲ形状を備えている。【選択図】図７