SEMICONDUCTOR DEVICE

• Main Authors: TAKAHARA MARIKO, TADA KAZUHIRO, BETSUSHIBA NORIYUKI
• Format: Patent
• Language: English; Japanese
• Published: 16.07.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor device which inhibits peeling and cracks in a simple structure to achieve high reliability.SOLUTION: A semiconductor device 100 comprises: a heat sink 10 on which a plurality of internal modules each including a semiconductor element substrate in which a semiconductor electrode is fastened on a surface electrode, a plurality of main terminals 5a, 5b bonded to a top face of the semiconductor element and the surface electrode, respectively, and a first encapsulation resin 9 for encapsulating the inside of a first case 4 provided on a peripheral part of the surface electrode so as to cover the semiconductor element and the semiconductor element substrate; and a second encapsulation resin 13 for encapsulating the inside of a second case 12 provided on a peripheral part of the heat sink so as to cover the first encapsulation resin, the first case and the semiconductor element substrate. At least the surface electrode inside the first case covers a whole area of an insulation substrate and the surface electrode and a rear face electrode are formed symmetry with respect to the insulation substrate. The plurality of main terminals are exposed to the outside of the second encapsulation resin and an elastic modulus of the second encapsulation resin is smaller than an elastic modulus of the first encapsulation resin. 【課題】単純な構造で剥離やクラックを抑制した高い信頼性の半導体装置の提供。【解決手段】表面電極上に半導体素子が固着された半導体素子基板と、半導体素子の上面及び表面電極にそれぞれ接合された複数の主端子５ａ，５ｂと、表面電極の周辺部に設けた第１のケース４の内部を、半導体素子と半導体素子基板とを覆うように封止する第１の封止樹脂９とを備えた内部モジュールが複数配置された放熱板１０と、放熱板の周辺部に設けられた第２のケース内部１２を、第１の封止樹脂と第１のケースと半導体素子基板とを覆うように封止する第２の封止樹脂１３と、を備えた半導体装置１００において、少なくとも第１のケース内部の表面電極は、絶縁基板全体を被覆し、かつ表面電極と裏面電極は、絶縁基板に対して対称に形成されており、複数の主端子は第２の封止樹脂の外部に露出するとともに、第２の封止樹脂の弾性率が第１の封止樹脂の弾性率よりも小さい半導体装置。【選択図】図４