SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To obtain a semiconductor device which has high reliability in heat cycle.SOLUTION: A semiconductor device comprises: a semiconductor element substrate in which a surface electrode is formed on one surface of an insulating substrate and a back electrode is formed on the other s...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
16.07.2015
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To obtain a semiconductor device which has high reliability in heat cycle.SOLUTION: A semiconductor device comprises: a semiconductor element substrate in which a surface electrode is formed on one surface of an insulating substrate and a back electrode is formed on the other surface of the insulating substrate; a semiconductor element fastened to a surface of the surface electrode on the side opposite to the insulating substrate via a bonding material; a case in which a first main terminal bonded to the surface electrode, a second main terminal bonded to a surface of the semiconductor element on the side opposite to the surface electrode and a signal terminal provided to include at least the semiconductor element inside, for inputting/outputting electric signals are integrally molded; and an encapsulation resin for encapsulating the inside of the case so as to cover at least the semiconductor element. The fist main terminal and the second main terminal pierce the encapsulation resin to be exposed to the outside of the encapsulation resin and a material of the signal terminal is different from materials of the first main terminal and the second main terminal.
【課題】ヒートサイクル信頼性が高い半導体装置を得ることを目的とする。【解決手段】絶縁基板の片面に表面電極が、および絶縁基板の他の面に裏面電極が、それぞれ形成された半導体素子基板と、表面電極の絶縁基板とは反対側の面に接合材を介して固着された半導体素子と、表面電極に接合された第1の主端子および半導体素子の表面電極とは反対側の面に接合された第2の主端子と、少なくとも半導体素子を内側に含むように設けられ、電気信号の入出力を行うための信号端子が一体成型されたケースと、ケースの内部を、少なくとも半導体素子を覆うように封止する封止樹脂とを備えた半導体装置において、第1の主端子および第2の主端子は封止樹脂を貫通して封止樹脂の外部に露出するとともに、信号端子の材料が第1の主端子および第2の主端子の材料と異なるようにした。【選択図】図1 |
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Bibliography: | Application Number: JP20140002130 |