PHOTORESIST OVERCOAT COMPOSITION

PROBLEM TO BE SOLVED: To provide an overcoat composition that can solve a problem of an additive-type quencher in negative type development, and a method for forming an electronic device.SOLUTION: The method for forming an electronic device includes the following steps in sequence: (a) providing a s...

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Bibliographic Details
Main Authors PARK JONG KEUN, CHRISTOPHER NAM LEE, CECILY ANDES, LEE CHOONG-BONG
Format Patent
LanguageEnglish
Japanese
Published 16.07.2015
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Summary:PROBLEM TO BE SOLVED: To provide an overcoat composition that can solve a problem of an additive-type quencher in negative type development, and a method for forming an electronic device.SOLUTION: The method for forming an electronic device includes the following steps in sequence: (a) providing a semiconductor substrate comprising one or more layers to be patterned; (b) forming a photoresist layer over the one or more layers to be patterned, the photoresist layer formed from a composition that comprises a matrix polymer comprising a unit having an acid labile group, a photoacid generator, and an organic solvent; (c) coating the photoresist layer with a photoresist overcoat composition that comprises a quenching polymer and an organic solvent, the quenching polymer comprising a unit having a basic portion effective to neutralize an acid generated by the photoacid generator in a surface region of the photoresist layer; (d) exposing the photoresist layer to activation radiation; (e) heating the substrate in a post-exposure bake process; and (f) developing the exposed film with an organic solvent developer. 【課題】ネガ型現像における添加型クエンチャーによる問題を解決できるオーバーコート組成物および電子デバイスの形成方法を提供する。【解決手段】(a)パターン化される1以上の層を含む半導体基体を提供し、(b)パターン化される1以上の層の上に、酸不安定基を有する単位を含むマトリックスポリマー、光酸発生剤、および有機溶媒を含む組成物からなるフォトレジスト層を形成し、(c)フォトレジスト層の上に、フォトレジスト層表面領域において光酸発生剤により生成される酸を中和するのに効果的な塩基性部分を有する単位を含むクエンチングポリマー、および有機溶媒を含むフォトレジストオーバーコート組成物をコーティングし、(d)フォトレジスト層を活性化放射線に露光し、(e)露光後ベークプロセスにおいて基体を加熱し;および(f)露光したフィルムを有機溶媒現像剤で現像する工程を順に含む電子デバイスの形成方法。【選択図】なし
Bibliography:Application Number: JP20150000586