LIGHT-EMITTING DEVICE

PROBLEM TO BE SOLVED: To provide a light-emitting device which is excellent in heat resistance and has good color reproducibility.SOLUTION: There is provided a light-emitting device which includes: a substrate; a light-emitting element arranged on the surface of the substrate; a first resin layer wh...

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Bibliographic Details
Main Author AKAZAWA YUJI
Format Patent
LanguageEnglish
Japanese
Published 09.07.2015
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Summary:PROBLEM TO BE SOLVED: To provide a light-emitting device which is excellent in heat resistance and has good color reproducibility.SOLUTION: There is provided a light-emitting device which includes: a substrate; a light-emitting element arranged on the surface of the substrate; a first resin layer which surrounds the side part of the light-emitting element and is arranged apart from the side part, on the surface of the substrate; and a second resin layer which is arranged so as to cover the light-emitting element and the first resin layer, on the surface of the substrate, and exists in the upper part of the light-emitting element, the upper part of the first resin layer, and a region between the light-emitting element and the first resin layer. The first resin layer contains a light-permeable resin, and a first fluorescent body which is excited by at least a part of light emitted from the light-emitting element and emits fluorescence. The second resin layer contains a light-permeable resin, and a second fluorescent body which is excited by at least a part of light emitted from the light-emitting element and emits fluorescence. The second fluorescent body has higher heat resistance than that of the first fluorescent body. 【課題】耐熱性に優れ、色再現性の良好な発光装置を提供する。【解決手段】基体と、基体の表面に配置される発光素子と、基体の表面において、発光素子の側部を囲み且つ側部と離間して配置される第1の樹脂層と、基体の表面において、発光素子および第1の樹脂層を覆うように配置される第2の樹脂層であって、第2の樹脂層は、少なくとも、発光素子の上部、第1の樹脂層の上部、および発光素子と第1の樹脂層との間の領域に存在する、第2の樹脂層とを含む発光装置であって、第1の樹脂層は、光透過性樹脂と、発光素子が発する光の少なくとも一部により励起されて蛍光を発する第1の蛍光体とを含み、第2の樹脂層は、光透過性樹脂と、発光素子が発する光の少なくとも一部により励起されて蛍光を発する第2の蛍光体とを含み、第2の蛍光体は第1の蛍光体よりも耐熱性が高い、発光装置。【選択図】図1(b)
Bibliography:Application Number: JP20130272688