PRODUCTION METHOD OF ELECTROMAGNETIC WAVE SHIELDING FILM AND ELECTROMAGNETIC WAVE SHIELDING FILM PRODUCED BY THAT METHOD METHODFORMANUFACTURINGELECTROMAGNETICINTERFERENCESHIELDINGFILMANDELECTROMAGNETICINTERFERENCESHIELDINGFILMMANUFACTUREDTHEREOF

• Main Authors: CHUNG KWANGOON, CHO NAM-BOO, HUH YOU SUNGL, SONG JUNG-GEUN, KIM DO-HYUN, JIN SEOK PIL
• Format: Patent
• Language: English; Japanese
• Published: 06.07.2015
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a production method of an electromagnetic wave shielding film, and to provide an electromagnetic wave shielding film produced by that method.SOLUTION: An electromagnetic wave shielding film is produced by a method including an insulation layer formation step for forming an insulation layer 20 on a first release film 11, a metal patterning step for printing a metal pattern 30 on the insulation layer, a conductive adhesive layer formation step for forming a conductive adhesive layer 40 on a second release film 12, and a release film combination step for forming an electromagnetic wave shielding film by combining the first and second release films so that the metal pattern and the conductive adhesive layer come into contact with each other. Excellent durability is ensured by enhancing adhesion between respective layers composing a shielding film, and efficiency of the production process can be enhanced. 【課題】電磁波遮蔽フィルムの製造方法及びこれから製造された電磁波遮蔽フィルムに関する。【解決手段】第１離型フィルム１１上に絶縁層２０を形成する絶縁層形成段階と、前記絶縁層上に金属パターン３０を印刷する金属パターン形成段階と、第２離型フィルム１２上に導電性接着剤層４０を形成する導電性接着剤層形成段階、及び前記金属パターンと前記導電性接着剤層が当接するように前記第１離型フィルム及び第２離型フィルムを合紙して電磁波遮蔽フィルムを形成する離型フィルム合紙段階を含んで製造される。遮蔽フィルムを構成する各層の間の付着力が向上して耐久性に優れ、製造工程の効率を上げることができる。【選択図】図２