METHOD FOR MANUFACTURING WIRING BOARD

• Main Authors: HIGUCHI NAOKI, AZUMA HIROKAZU
• Format: Patent
• Language: English; Japanese
• Published: 06.07.2015
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board by which a filled via with high conductivity, heat dissipation, and connection reliability is formed by performing a heat treatment step at a low temperature so as not to deteriorate an insulating layer while using a conductive paste.SOLUTION: A wiring board 1 comprises at least a first conductive layer 2 and a second conductive layer 3. The first conductive layer 2 and the second conductive layer 3 each individually include an insulating layer 4. A method for manufacturing the wiring board comprises: a step S1 of forming a through hole 5 (boring step); a step S2 of filling the through hole 5 with a paste 6 (pasting step); a step S3 of drying the paste 6 by heating the wiring board 1 (drying step); a step S4 of impregnating the through hole 5 with an organometallic complex solution 7 (impregnating step); and a step S5 of forming a filled via 8 by reducing the organometallic complex solution 7 by heating the wiring board 1 (heating step). The filled via 8 with high conductivity, heat dissipation, and connection reliability is formed by the method for manufacturing the wiring board. 【課題】導電ペーストを用いながら、絶縁層を劣化させないように低温での熱処理工程によって、高い導電性、放熱性、接続信頼性を備えたフィルドビアを形成する配線基板の製造方法を提供する。【解決手段】配線基板１は、少なくとも第１導体層２と第２導体層３からなり、第１導体層２と第２導体層３とはそれぞれ絶縁層４を備えている。配線基板の製造方法は、貫通孔５形成する孔空け工程Ｓ１と、貫通孔５にペースト６を充填するペースト工程Ｓ２と、配線基板１を加熱しペースト６を乾燥する乾燥工程Ｓ３と、貫通孔５に有機金属錯体溶液７を浸透させる含浸工程Ｓ４と、配線基板１を加熱し有機金属錯体溶液７を還元してフィルドビア８を形成する加熱工程Ｓ５とからなる。配線基板の製造方法により高い導電性、放熱性、接続信頼性を備えたフィルドビア８を形成する。【選択図】図１