IMAGING DEVICE AND IMAGING SYSTEM

PROBLEM TO BE SOLVED: To suppress light transmitted from a light-receiving pixel region side to a shielded pixel region from being entered into the shielded pixel region, and to reduce an optical path difference to light entered into each pixel in the light-receiving pixel region.SOLUTION: An imagin...

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Bibliographic Details
Main Authors SUZUKI KENTARO, TEZUKA TOMOYUKI
Format Patent
LanguageEnglish
Japanese
Published 06.07.2015
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Summary:PROBLEM TO BE SOLVED: To suppress light transmitted from a light-receiving pixel region side to a shielded pixel region from being entered into the shielded pixel region, and to reduce an optical path difference to light entered into each pixel in the light-receiving pixel region.SOLUTION: An imaging device comprises: a light-receiving pixel region; a first pixel region; a second pixel region; a first wiring layer arranged above the light-receiving pixel region; and a second wiring layer arranged above the second pixel region and above a wiring layer located uppermost, of wiring layers arranged on the light-receiving pixel region. The first pixel region is adjacent to the light-receiving pixel region and the second pixel region, and arranged between the light-receiving pixel region and the second pixel region. In a plan view, the first pixel region is overlapped with a first light shielding part included in the first wiring layer, and the second pixel region is overlapped with a second light shielding part included in the second wiring layer. On the first wiring layer, a conductive pattern is formed at a position overlapped with the second pixel region. 【課題】 被遮光画素領域に対して受光画素領域の側から進入してくる光が被遮光画素領域に入射する事を抑制し、かつ受光画素領域内における各画素に入射する光に対してその光路差を低減する。【解決手段】 撮像装置において、受光画素領域と、第1の画素領域と、第2の画素領域と、受光画素領域の上方に配された第1の配線層と、第2の画素領域の上方であって、受光画素領域の上に配された配線層のうち最上に位置する配線層よりも上方に配された第2の配線層とを備え、第1の画素領域は、受光画素領域と第2の画素領域とに隣接し且つ受光画素領域と第2の画素領域の間に配されており、平面視において、第1の画素領域は第1の配線層が有する第1の遮光部と重なっており、第2の画素領域は第2の配線層が有する第2の遮光部と重なっており、第1の配線層には第2の画素領域と重なる位置に導電パターンが形成されている。【選択図】 図2
Bibliography:Application Number: JP20130267139